Structure and method for 3D FinFET metal gate

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United States of America Patent

PATENT NO 9876114
SERIAL NO

14687447

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Abstract

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The present disclosure provides a semiconductor structure in accordance with some embodiments. The semiconductor structure includes a semiconductor substrate; and a gate stack disposed on the semiconductor substrate; wherein the gate stack includes a high k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer, wherein the gate stack has a convex top surface.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JangJian, Shiu-Ko Hsin-Chu, TW 172 1310
Lin, Chun Che Hsin-Chu, TW 26 297
Wang, Ting-Chun Hsin-Chu, TW 91 665
Wu, Chih-Nan Hsin-Chu, TW 26 327

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