Semiconductor device having semiconductor elements on semiconductor substrate

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United States of America Patent

PATENT NO 9876107
SERIAL NO

14904245

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Abstract

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A semiconductor device includes a semiconductor substrate and a semiconductor element arranged on a predetermined surface side of the semiconductor substrate. The semiconductor element includes: a first region portion at which a first conductivity type semiconductor region is arranged on the surface side of the semiconductor substrate; a second region portion at a position separated from the first region portion; and a gate electrode arranged between the first region portion and the second region portion through an insulating film. In the first region portion, a first conductivity type semiconductor region is arranged. In the second region portion, a first conductivity type semiconductor region and a second conductivity type semiconductor region are alternately arranged. The semiconductor structure portions with a variety of types having ratios of the first conductivity type semiconductor region to the second conductivity type semiconductor region different from each other are provided at the second region portion.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-CITY AICHI-PREF 448-8661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yanagi, Shinichiro Kariya, JP 12 141

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