Semiconductor substrate and semiconductor device

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United States of America Patent

PATENT NO 9876101
SERIAL NO

15302684

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Abstract

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A semiconductor substrate including a substrate, a buffer layer having a nitride-based semiconductor containing carbon provided on the substrate, a high-resistance layer having a nitride-based semiconductor containing carbon provided on the buffer layer, and a channel layer having a nitride-based semiconductor provided on the high-resistance layer, the high-resistance layer including a first region having carbon concentration lower than that of the buffer layer, and a second region which is provided between the first region and the channel layer, and has the carbon concentration higher than the first region. As a result, it is possible to provide the semiconductor substrate which can reduce a leak current by enhancing crystallinity of the high-resistance layer while maintaining a high resistance of the high-resistance layer, and suppress occurrence of a decrease in electron mobility or current collapse in the channel layer by likewise enhancing crystallinity of the channel layer formed on the high-resistance layer.

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Patent Owner(s)

Patent OwnerAddress
SANKEN ELECTRIC CO LTDSAITAMA PREFECTURE JAPAN SAITAMA
SHIN-ETSU HANDOTAI CO LTD2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 1000004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Hirokazu Minato-ku, JP 49 988
Hagimoto, Kazunori Takasaki, JP 41 187
Sato, Ken Miyoshi, JP 116 1112
Shikauchi, Hiroshi Niiza, JP 31 69
Shinomiya, Masaru Annaka, JP 29 87
Tsuchiya, Keitaro Takasaki, JP 30 59

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