Device and structure and method for forming the same
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United States of America Patent
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Jan 23, 2018
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app pub date -
May 14, 2013
filing date -
May 15, 2012
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Abstract
In various embodiments, a method for forming a device may be provided. The method may include forming a contact layer at least partially on a substrate. The method may also include forming a device structure adhered to the contact layer. In addition, the method may include depositing a transfer medium such that the device structure is at least partially covered by the transfer medium. The method may further include solidifying the transfer medium. The method may also include separating the contact layer, the device structure and the transfer medium from the substrate. The contact layer may have a greater adhesion to the device structure than to the substrate.
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