Three-dimensional semiconductor device and method for forming the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Dec 2, 2016
filing date -
Dec 2, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A three-dimensional semiconductor device includes a multi-layered stack structure with memory layers parallel to each other and separated by interlayer insulation layers; and memory cell structures formed at each memory layer by arranging in a multi-row and multi-column array. One memory cell structure includes a memory material layer; a selector layer formed at an outer surface of the memory material layer and connected to the memory material layer; a first electrode layer formed at an outer surface of the selector layer and electrically connected to the selector layer; and a second electrode layer formed at an inner surface of the memory material layer and connected to the memory material layer, wherein the second electrode layer penetrates the multi-layered stack structure. Each memory layer includes a conductive layer electrically connecting the first electrode layer and the conductive layer electrically connects the adjacent memory cell structures.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully