Stacked semiconductor chip RGBZ sensor
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United States of America Patent
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Jan 23, 2018
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N/A
app pub date -
Nov 23, 2016
filing date -
Dec 22, 2014
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Abstract
An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.
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