METHOD FOR MANUFACTURING TFT SUBSTRATE
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United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Jan 29, 2016
filing date -
Dec 3, 2015
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
The present invention provides a method for manufacturing a TFT substrate, in which after induced crystallization is conducted by implanting ions into an amorphous silicon layer, there is no need to completely remove the ion induction layer formed on the surface of a poly-silicon layer so obtained and instead, a half-tone mask based operation is applied to remove only a portion of the ion induction layer corresponding to a channel zone and there is no need for re-conducting ion implantation subsequently for source/drain contact zones, thereby saving the mask necessary for re-conducting ion implantation. Further, the source/drain electrodes are also formed with the half-tone mask based operation so as to save the mask necessary for making the source/drain electrodes. Further, the source/drain electrodes are formed first so that the formation of an interlayer insulation layer can be omitted thereby saving the mask necessary for forming the interlayer insulation layer. Through the adoption of a half-tone mask base operation, the method for manufacturing a TFT substrate according to the present invention can reduce the nine masks that are involved in the prior art techniques to only six masks, thereby effectively simplifying the manufacturing process, improving manufacturing efficiency, and saving manufacturing cost.
First Claim
Other Claims data not available
