Stack chip package and method of manufacturing the same
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United States of America Patent
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Jan 23, 2018
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app pub date -
Jun 6, 2016
filing date -
Mar 17, 2016
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Abstract
A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.
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