Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same
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United States of America Patent
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Jan 23, 2018
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N/A
app pub date -
Aug 9, 2015
filing date -
Sep 11, 2014
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Abstract
An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.
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