Package module having exposed heat sink
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United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Mar 16, 2016
filing date -
Jun 5, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.
First Claim
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 23, 2025 |
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