Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices

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United States of America Patent

PATENT NO 9875987
SERIAL NO

15247393

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Abstract

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An electronic device includes a semiconductor die having a lower surface, a sintered metallic layer underlying the lower surface of the semiconductor die, a conductive layer underlying the sintered metallic layer, and a conductive substrate underlying the conductive layer.

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Patent Owner(s)

Patent OwnerAddress
NXP USA INC6501 WILLIAM CANNON DRIVE WEST AUSTIN TX 78735

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Molla, Jaynal A Gilbert, US 48 933
Viswanathan, Lakshminarayan Phoenix, US 95 679

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