Semiconductor chip device

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United States of America Patent

PATENT NO 9875978
SERIAL NO

15292219

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Abstract

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According to various embodiments, a method may include: forming a first layer on a surface using a first lift-off process; forming a second layer over the first layer using a second lift-off process; wherein the second lift-off process is configured such that the second layer covers at least one sidewall of the first layer at least partially.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGCAMPBELL 1-15 NAUBIBERG GERMANY NEUBIBERG BAVARIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bonart, Dietrich Bad Abbach, DE 47 153
Debie, Martina Bogen, DE 4 3
Gatterbauer, Johann Parsberg, DE 20 45
Gross, Thomas Sinzing, DE 65 456
Weidgans, Bernhard Bernhardswald, DE 32 53

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