Fan-out semiconductor package
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Jan 24, 2017
filing date -
Apr 25, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.
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