Semiconductor device components and methods

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United States of America Patent

PATENT NO 9875964
SERIAL NO

14166686

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Abstract

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Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Lee-Der Chupei, TW 2 7
Chiu, Chwei-Ching Hsin-Chu, TW 9 182
Hsieh, Ming-Hong Bade, TW 14 21
Lin, Bi-Ling Hsin-Chu, TW 12 59
Lin, Jian-Hong Yunlin, TW 67 510
Shih, Jiaw-Ren Hsin-Chu, TW 66 805

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