Semiconductor device

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United States of America Patent

PATENT NO 9875963
SERIAL NO

14848810

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Abstract

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According to one embodiment, an integrated circuit is formed on a semiconductor chip, a regulator supplies power to the integrated circuit via the power-supply wire, a first resistor is connected between the first pad electrode and the power-supply wire on the semiconductor chip, and a second resistor is connected between the second pad electrode and the power-supply wire on the semiconductor chip and has a resistance smaller than that of the first resistor.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 108-0023

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ideno, Hiroyuki Yokohama, JP 7 18
Kushibe, Hidefumi Kamakura, JP 10 29
Usuda, Masayuki Ota, JP 20 60

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