Semiconductor device
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United States of America Patent
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Jan 23, 2018
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app pub date -
Mar 3, 2015
filing date -
Mar 4, 2014
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Abstract
A semiconductor device includes a heat source and a heat detection element which are formed on a semiconductor substrate; and a heat conductive member formed across both of the heat source and the heat detection element, a thermal conductivity of the heat conductive member being higher than a thermal conductivity of the semiconductor substrate, and wherein the heat source, the heat detection element and the heat conductive member are integrated on the semiconductor substrate.
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