Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures
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United States of America Patent
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Jan 23, 2018
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N/A
app pub date -
Jun 24, 2016
filing date -
Jun 24, 2016
priority date (Note) -
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Abstract
In an embodiment, a substrate includes semiconductor material and a conductive via. The conductive via includes a via in the substrate, a conductive plug filling a first portion of the via and a conductive liner layer that lines side walls of a second portion of the via and is electrically coupled to the conductive plug. The conductive liner layer and the conductive plug have different microstructures.
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