Method for singulating packaged integrated circuits and resulting structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Oct 30, 2013
filing date -
Oct 30, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of packaging an integrated circuit includes forming a first integrated circuit and a second integrated circuit on a wafer, the first and second integrated circuit separated by a singulation region. The method includes covering the first and second integrated circuits with a molding compound, and sawing through a top portion of the molding compound using a first beveled saw blade, while leaving a bottom portion of the molding compound remaining. The method further includes sawing through the bottom portion of the molding compound and the wafer using a second saw blade, the second saw blade having a thickness that is less than a thickness of the first saw blade. The resulting structure is within the scope of the present disclosure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully