Multilayer ceramic electronic component and board having the same mounted thereon
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United States of America Patent
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Jan 23, 2018
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N/A
app pub date -
Dec 22, 2016
filing date -
Sep 17, 2013
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Abstract
There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; and first and second internal electrodes stacked to face each other, having the dielectric layer interposed therebetween, within the ceramic body, wherein when an average width of the first and second internal electrodes stacked at an upper portion of the ceramic body in a thickness direction is M1 and an average width of the first and second internal electrodes stacked at a lower portion of the ceramic body in the thickness direction is M2, M1>M2 is satisfied.
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