Chip coil component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Nov 30, 2016
filing date -
Jun 19, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip coil component may include: a ceramic body including a plurality of first to fourth insulating layers, and an internal coil including a first internal pattern part having the plurality of first insulating layers on which first pattern portions are disposed and a second internal pattern part having the plurality of second insulating layers on which second pattern portions are disposed. The first pattern portions disposed on the plurality of first insulating layers are disposed to correspond to each other and are connected to each other by two first connection terminals each having one via electrode, and the second pattern portions disposed on the plurality of second insulating layers are disposed to correspond to each other and are connected to each other by two second connection terminals each having one via electrode.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01F Class
- 2147 Applications Filed
- 1680 Patents Issued To-Date
- 78.25 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01F Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 23, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 23, 2029 |
