Coil electronic component
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Apr 1, 2016
filing date -
Apr 16, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.
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