Coil electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9875837
SERIAL NO

15088653

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

International Classification(s)

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  • 2016 Application Filing Year
  • H01F Class
  • 2147 Applications Filed
  • 1680 Patents Issued To-Date
  • 78.25 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Dong Jin Suwon-si, KR 52 346
Lee, Kyung Seop Suwon-si, KR 5 45

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Patent Citation Ranking

  • 3 Citation Count
  • H01F Class
  • 29.87 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1904092655101 - 1011 - 2021 - 3031 - 4041 - 500255075100125150175200225250275300325350375400425450

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