3D structure for advanced SRAM design to avoid half-selected issue

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United States of America Patent

PATENT NO 9875789
SERIAL NO

14087029

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Abstract

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Systems are provided for a three dimension static random access memory (SRAM) structure. The SRAM structure comprises a plurality of memory array layers, layer decoder circuitry on each memory array layer, a word line driver circuit disposed on each memory array layer, and a plurality of complementary bit line pairs extending vertically from a memory cell in a first memory array layer to a memory cell in a second memory array layer. The layer decoder circuitry on each memory array layer is configured to decode a portion of an SRAM address to determine if the SRAM address corresponds to memory cells on its memory array layer. The word line driver circuit disposed on each memory array layer is configured to operate cooperatively with a partial SRAM address decoder to select and drive one of the plurality of word lines disposed on its memory array layer, wherein a selected word line is connected to a predetermined number of memory cells in a specific memory array layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDNO 8 LI-HSIN 6 ROAD HSINCHU SCIENCE PARK HSINCHU ROC 30077

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Yuan Hsinchu, TW 134 979
Huang, Chien-Yu Taoyuan County, TW 34 446
Shieh, Hau-Tai Hsinchu, TW 82 237

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