Fingerprint sensor device and method

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United States of America Patent

PATENT NO 9875388
SERIAL NO

15149903

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Abstract

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A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Hua Zhubei, TW 138 2193
Chen, Yu-Feng Hsin-Chu, TW 119 1102
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Tsai, Hao-Yi Hsin-Chu, TW 489 3426
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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