Fingerprint sensor and packaging method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Jul 15, 2016
filing date -
May 16, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A fingerprint sensor is provided. The fingerprint sensor includes a multi-layer printed circuit board (PCB), a fingerprint sensing die and a molding compound. The multi-layer PCB includes a bottom dielectric layer, at least one intermediate dielectric layer disposed on the bottom dielectric layer, a top dielectric layer disposed on the intermediate dielectric layer and a trench. The trench is formed by digging out a portion of the intermediate dielectric layer and a portion of the top dielectric layer. The fingerprint sensing die is disposed in the trench of the multi-layer PCB and mounted on an upper surface of the bottom dielectric layer of the multi-layer PCB. The fingerprint sensing die includes a sensing array capable of sensing fingerprint information of a user. The fingerprint sensing die is covered by the molding compound, and the trench of the multi-layer PCB is filled with the molding compound.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully