System and process for fabricating semiconductor packages
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United States of America Patent
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Jan 23, 2018
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app pub date -
Oct 19, 2015
filing date -
Sep 19, 2008
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Abstract
A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly. The method includes aligning the laser assembly with the carrier and laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner.
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