Co-packaging photonic integrated circuits and application specific integrated circuits
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United States of America Patent
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Jan 23, 2018
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Apr 26, 2013
filing date -
Apr 26, 2012
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Abstract
Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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