System and method for electrical testing of through silicon vias (TSVs)
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United States of America Patent
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Jan 23, 2018
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Aug 17, 2015
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Feb 16, 2010
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Abstract
A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.
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