Electromagnetic shield for testing integrated circuits
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United States of America Patent
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Jan 23, 2018
Grant Date -
Feb 26, 2015
app pub date -
Nov 5, 2014
filing date -
Aug 28, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.
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