Airflow sensor for a heat sink
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Feb 15, 2016
filing date -
Feb 15, 2016
priority date (Note) -
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Abstract
An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.
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