Copper alloy
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United States of America Patent
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Jan 23, 2018
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app pub date -
Mar 24, 2016
filing date -
Sep 26, 2013
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Abstract
A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 10≦[Zn]−0.3×[Sn]−2×[Ni]≦28, 10≦f3={f1×(32−f1)×[Ni]}1/2≦33, 1.2≦0.7×[Ni]+[Sn]≦4, and 1.4≦[Ni]/[Sn]≦90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % in an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7.
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