Highly conductive material formed by hybridization of metal nanomaterial and carbon nanomaterial having higher-order structure due to multiple hydrogen bonding, and manufacturing method therefor
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Sep 25, 2015
filing date -
Apr 1, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to a highly conductive material formed by hybridization of a metal nanomaterial and a carbon nanomaterial having a higher-order structure due to multiple hydrogen bonding, and to a manufacturing method therefor. The technical essence of the present invention is a highly conductive material formed by hybridization of a metal nanomaterial and a carbon nanomaterial having a higher-order structure due to multiple hydrogen bonding the invention involving: forming a carbon nanomaterial having a higher-order structure due to multiple hydrogen bonding between conductive carbon nanomaterials by introducing a functional group capable of multiple hydrogen bonding to the carbon nanomaterials; forming a composite material by mixing the carbon nanomaterial having a higher-order structure and a metal nanomaterial.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE | CHANGWON-SI GYEONGSANGNAM-DO 51543 |
International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- B82Y:SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; ....
- C07D:HETEROCYCLIC COMPOUNDS
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

- 2015 Application Filing Year
- C09K Class
- 2848 Applications Filed
- 2073 Patents Issued To-Date
- 72.79 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Baeg, Kang-jun | Changwon-si, KR | 10 | 23 |
# of filed Patents : 10 Total Citations : 23 | |||
Han, Joong-tark | Changwon-si, KR | 5 | 60 |
# of filed Patents : 5 Total Citations : 60 | |||
Jeong, Bo-hwa | Busan, KR | 1 | 7 |
# of filed Patents : 1 Total Citations : 7 | |||
Jeong, Hee-jin | Changwon-si, KR | 7 | 71 |
# of filed Patents : 7 Total Citations : 71 | |||
Jeong, Seung-yol | Gimhae-si, KR | 6 | 60 |
# of filed Patents : 6 Total Citations : 60 | |||
Lee, Geon-woong | Changwon-si, KR | 8 | 102 |
# of filed Patents : 8 Total Citations : 102 |
Cited Art Landscape
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Patent Citation Ranking
- 3 Citation Count
- C09K Class
- 32.37 % this patent is cited more than
- 7 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 23, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 23, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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Feb 25, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8 |
Feb 23, 2017 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Sep 03, 2013 | I | Issuance | |
Aug 14, 2013 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jun 09, 2013 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GREENFELD, ISRAEL;YAVIN, ZVI;UHL, BERND;SIGNING DATES FROM 20030331 TO 20030508;REEL/FRAME:030573/0502 Owner name: RAFAEL ARMAMENT DEVELOPMENT AUTHORITY LTD., ISRAEL |
Sep 04, 2008 | P | Published | |
Oct 29, 2007 | F | Filing | |
Jan 23, 2004 | PD | Priority Date |

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