Polyamide resin composition, method of manufacturing and molded product
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United States of America Patent
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Jan 23, 2018
Grant Date -
Sep 15, 2016
app pub date -
Aug 28, 2014
filing date -
Oct 18, 2013
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Abstract
A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.
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