Shape memory thermal interface materials

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United States of America Patent

PATENT NO 9873774
SERIAL NO

15254055

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Abstract

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Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuczynski, Joseph North Port, US 573 2251
O'Connell, Kevin M Rochester, US 37 126
Peterson, Chelsie M Dexter, US 21 51
Plucinski, Mark D Toms River, US 41 174
Tofil, Timothy J Rochester, US 114 490

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