Multiple bonding in wafer level packaging

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9873610
SERIAL NO

13929623

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Abstract

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A MEMS device is described. The device includes a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, a semiconductor substrate including a second bonding layer, and a cap including a third bonding layer, the cap coupled to the semiconductor substrate by bonding the second bonding layer to the third bonding layer. The first bonding layer includes silicon, the semiconductor substrate is electrically coupled to the MEMS substrate by bonding the first bonding layer to the second bonding layer, and the MEMS substrate is hermetically sealed between the cap and the semiconductor substrate.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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  • 2013 Application Filing Year
  • B81C Class
  • 446 Applications Filed
  • 316 Patents Issued To-Date
  • 70.86 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chun-Wen Zhubei, TW 259 3778
Chu, Chia-Hua Zhubei, TW 192 2736
Chu, Li-Cheng Taipei, TW 20 111
Hsieh, Yuan-Chih Hsinchu, TW 102 1115
Lin, Chung-Hsien Hsinchu, TW 82 1467

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Patent Citation Ranking

  • 0 Citation Count
  • B81C Class
  • 0 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1411201 - 1011 - 2021 - 3041 - 5000.250.50.7511.251.51.7522.252.52.7533.253.53.7544.25

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