Multiple bonding in wafer level packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Jun 27, 2013
filing date -
Sep 28, 2010
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A MEMS device is described. The device includes a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, a semiconductor substrate including a second bonding layer, and a cap including a third bonding layer, the cap coupled to the semiconductor substrate by bonding the second bonding layer to the third bonding layer. The first bonding layer includes silicon, the semiconductor substrate is electrically coupled to the MEMS substrate by bonding the first bonding layer to the second bonding layer, and the MEMS substrate is hermetically sealed between the cap and the semiconductor substrate.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD | 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78 |
International Classification(s)

- 2013 Application Filing Year
- B81C Class
- 446 Applications Filed
- 316 Patents Issued To-Date
- 70.86 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Cheng, Chun-Wen | Zhubei, TW | 259 | 3778 |
# of filed Patents : 259 Total Citations : 3778 | |||
Chu, Chia-Hua | Zhubei, TW | 192 | 2736 |
# of filed Patents : 192 Total Citations : 2736 | |||
Chu, Li-Cheng | Taipei, TW | 20 | 111 |
# of filed Patents : 20 Total Citations : 111 | |||
Hsieh, Yuan-Chih | Hsinchu, TW | 102 | 1115 |
# of filed Patents : 102 Total Citations : 1115 | |||
Lin, Chung-Hsien | Hsinchu, TW | 82 | 1467 |
# of filed Patents : 82 Total Citations : 1467 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- B81C Class
- 0 % this patent is cited more than
- 7 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 23, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 23, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
