Electronic component conveyance device and method of manufacturing taping electronic component array

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United States of America Patent

PATENT NO 9873574
SERIAL NO

15182075

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Abstract

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As an electronic component conveyance device that aligns a stack direction of internal electrodes in an electronic component in a highly reliable manner. An interval between a first sidewall and a second sidewall in a midstream part is larger than an interval P3 between the first sidewall and the second sidewall in a downstream part. A first magnetic force generation unit is provided lateral to the first sidewall in the midstream part. The height of a center of the first magnetic force generation unit with respect to a bottom surface is larger than P3/2.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDKYOTO JAPAN KYOTO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ebata, Mitsuo Nagaokakyo, JP 2 8
Kakuho, Masaru Nagaokakyo, JP 5 9
Tanaka, Naoto Nagaokakyo, JP 30 212

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