Microfluidic assembly with mechanical bonds
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United States of America Patent
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Jan 23, 2018
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app pub date -
Sep 8, 2016
filing date -
Mar 14, 2016
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Abstract
Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
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