Method of manufacturing resin sealing module, and resin sealing module
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United States of America Patent
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Jan 23, 2018
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app pub date -
Oct 16, 2014
filing date -
Oct 16, 2014
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Abstract
A method of manufacturing a resin sealing module, which includes an injection step of injecting an uncured curable liquid resin into a module case and a positioning step of positioning the mold member, is provided. In the injection step, a substrate with electronic components is immersed into the curable liquid resin. In the positioning step, the mold member is positioned so that inside space of the first partition wall faces a second region. In the positioning step, at least a protruding end portion of the first partition wall is immersed into the curable liquid resin while a gas layer is held in the inside space. Thereby, a partial region of an upper surface of the curable liquid resin is depressed by the gas layer, so that this region is positioned lower in level than other regions.
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