Die repairing method and method for manufacturing functional film using same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 23, 2018
Issued Date -
N/A
app pub date -
Feb 7, 2013
filing date -
Feb 8, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
This is a mold repairing method for removing a resin material deposited on a mold, of which the surface is a porous film with a plurality of recesses that have been created through anodization. The mold repairing method includes the steps of: (I) removing the resin material that is exposed on the surface of the mold over the plurality of recesses without performing atmospheric pressure plasma processing; and (II) removing at least partially the resin material that is still left inside the plurality of recesses by the atmospheric pressure plasma processing, after the step (I) has been performed, thereby recovering the original function of the mold.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully