CMP pad construction with composite material properties using additive manufacturing processes

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9873180
APP PUB NO 20160107290A1
SERIAL NO

14695299

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Abstract

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Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bajaj, Rajeev Fremont, US 162 3380
Davenport, Robert E Los Gatos, US 23 615
Fung, Jason G Santa Clara, US 28 673
Krishnan, Kasiraman Milpitas, US 61 1444
Menk, Gregory E Pleasanton, US 49 864
Orilall, Mahendra C Santa Clara, US 32 855
Patibandla, Nag B Pleasanton, US 159 2040
Perry, Russell Edward Pleasanton, US 8 240
Redeker, Fred C Fremont, US 195 5499
Redfield, Daniel Morgan Hill, US 65 1172

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