Ultrasonic transducer and method of manufacturing the same

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United States of America Patent

PATENT NO 9873136
SERIAL NO

14701580

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Abstract

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An ultrasonic transducer and a method of manufacturing the same are provided. The ultrasonic transducer includes a substrate, a first insulation layer, and a first thin film layer; a plurality of support members formed on the first thin film layer; a second thin film layer supported by the plurality of support members; a cavity between the first thin film layer and the second thin film layer; and a common ground electrode on the second thin film layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

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  • 2015 Application Filing Year
  • B06B Class
  • 255 Applications Filed
  • 196 Patents Issued To-Date
  • 76.87 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Seokwhan Hwaseong-si, KR 26 108
Hong, Seogwoo Yongin-si, KR 77 151
Shim, Dongsik Hwaseong-si, KR 37 169

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Patent Citation Ranking

  • 0 Citation Count
  • B06B Class
  • 0 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1113101 - 1031 - 4001234567891011121314

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