Ultrasonic matrix array probe with thermally dissipating cable and backing block heat exchange
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United States of America Patent
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Jan 23, 2018
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N/A
app pub date -
Mar 1, 2013
filing date -
Mar 20, 2012
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Abstract
A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.
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