Device module and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9872409
SERIAL NO

13958926

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.

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Patent Owner(s)

Patent OwnerAddress
HOSIDEN CORPORATION4-33 KITAKYUHOJI 1-CHOME YAO-SHI OSAKA 5810071

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isoda, Takeshi Yao, JP 87 885
Shinoda, Koji Yao, JP 39 123

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Patent Citation Ranking

  • 2 Citation Count
  • H01L Class
  • 23.71 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 16, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 16, 2029