IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE COATING
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United States of America Patent
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app pub date -
Jul 22, 2016
filing date -
Jul 22, 2016
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Abstract
A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
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