IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING VIA PLUG DURING ELECTROPLATING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 8, 2016
filing date -
Aug 8, 2016
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully