Methods of sewing components in fabrics using metal wire cloth
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Apr 30, 2014
filing date -
Dec 9, 2013
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Abstract
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
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