Low dielectric composite material and laminate and printed circuit board thereof
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United States of America Patent
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Jan 16, 2018
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Jul 7, 2015
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Jul 10, 2014
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Abstract
The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
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