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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
DENKA COMPANY LIMITED	1-1 NIHONBASHI-MUROMACHI 2-CHOME CHUO-KU TOKYO 1038338 ?1038338

International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Aono, Ryota	Omuta, JP	6	10
Miyakawa, Takeshi	Omuta, JP	59	421
Yuasa, Akimasa	Omuta, JP	11	13

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 16, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 16, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 16, 2018	US,9872380,B2   US9872380B2	GRANTED PATENT AS SECOND PUBLICATION
June 22, 2017	US,20170181272,A1   US20170181272A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9872380

Ceramic circuit board and method for producing same

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