Transistor manufacturing method and transistor

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United States of America Patent

PATENT NO 9871215
SERIAL NO

15645208

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Abstract

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A transistor manufacturing method includes: forming a first insulator layer of which formation material is a fluorine-containing resin, on a substrate having a source electrode, a drain electrode, and a semiconductor layer so as to cover the semiconductor layer; forming a second insulator layer to cover the first insulator layer; forming a base film on at least part of a surface of the second insulator layer; and after depositing a metal which is an electroless plating catalyst on a surface of the base film, forming a gate electrode on the surface of the base film by electroless plating, wherein the forming of the base film is performed by applying a liquid substance which is a formation material of the base film to the surface of the second insulator layer, and the second insulator layer has a higher lyophilic property with respect to the liquid substance than the first insulator layer.

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Patent Owner(s)

Patent OwnerAddress
NIKON CORPORATION1-5-20 NISHIOI SHINAGAWA-KU TOKYO 140-8601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawakami, Yusuke Yokohama, JP 59 667
Koizumi, Shohei Atsugi, JP 28 21
Sugizaki, Takashi Yokohama, JP 15 37

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