Semiconductor device, manufacturing method thereof, and electronic device

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United States of America Patent

PATENT NO 9871145
SERIAL NO

15628699

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Abstract

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A semiconductor device includes a first insulating layer over a substrate, a first metal oxide layer over the first insulating layer, an oxide semiconductor layer over the first metal oxide layer, a second metal oxide layer over the oxide semiconductor layer, a gate insulating layer over the second metal oxide layer, a second insulating layer over the second metal oxide layer, and a gate electrode layer over the gate insulating layer. The gate insulating layer includes a region in contact with a side surface of the gate electrode layer. The second insulating layer includes a region in contact with the gate insulating layer. The oxide semiconductor layer includes first to third regions. The first region includes a region overlapping with the gate electrode layer. The second region, which is between the first and third regions, includes a region overlapping with the gate insulating layer or the second insulating layer. The second and third regions each include a region containing an element N (N is phosphorus, argon, or xenon).

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO LTDKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Takashi Kanagawa, JP 110 1272
Ito, Daigo Kanagawa, JP 69 300
Kurata, Motomu Kanagawa, JP 113 2202
Matsubayashi, Daisuke Kanagawa, JP 140 1945
Nagai, Masaharu Kanagawa, JP 45 1124
Okazaki, Yutaka Kanagawa, JP 104 2248
Sasagawa, Shinya Kanagawa, JP 254 4388
Yamade, Naoto Kanagawa, JP 50 659
Yamamoto, Yoshiaki Tokyo, JP 175 2386

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