Metal gate scheme for device and methods of forming
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Sep 30, 2015
filing date -
Sep 30, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Gate structures and methods of forming the gate structures are described. In some embodiments, a method includes forming source/drain regions in a substrate, and forming a gate structure between the source/drain regions. The gate structure includes a gate dielectric layer over the substrate, a work function tuning layer over the gate dielectric layer, a metal-containing compound over the work function tuning layer, and a metal over the metal-containing compound, wherein the metal-containing compound comprises the metal as an element of the compound.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD | 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78 |
International Classification(s)

- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Lee, Chia-Ching | New Taipei, TW | 68 | 220 |
# of filed Patents : 68 Total Citations : 220 | |||
Lee, Da-Yuan | Jhubei, TW | 144 | 1127 |
# of filed Patents : 144 Total Citations : 1127 | |||
Tsau, Hsueh Wen | Zhunan Township, TW | 38 | 364 |
# of filed Patents : 38 Total Citations : 364 | |||
Wu, Chung-Chiang | Hsin-Chu, TW | 73 | 237 |
# of filed Patents : 73 Total Citations : 237 |
Cited Art Landscape
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Patent Citation Ranking
- 5 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 16, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 16, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Mar 07, 2022 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Mar 07, 2022 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jan 28, 2022 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Jan 28, 2022 |
Sep 20, 2021 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jul 13, 2017 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Jan 28, 2014 | I | Issuance | |
Jan 08, 2014 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
May 24, 2012 | P | Published | |
Jun 15, 2011 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUGIYAMA, YUTA;YUASA, HIDEAKI;SANO, KIMINORI;SIGNING DATES FROM 20110523 TO 20110525;REEL/FRAME:026448/0464 Owner name: SUMITOMO HEAVY INDUSTRIES, LTD., JAPAN free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUGIYAMA, YUTA;YUASA, HIDEAKI;SANO, KIMINORI;SIGNING DATES FROM 20110523 TO 20110525;REEL/FRAME:026448/0464 Owner name: SUMITOMO (S.H.I.) CONSTRUCTION MACHINERY CO., LTD. |
Nov 17, 2009 | F | Filing | |
Nov 18, 2008 | PD | Priority Date |

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